THICK-SCAN L

THICK-SCAN L is a non-contact thickness gauge for insulations. Laser sensors are mounted both sides of the board, working on the triangulation principle. This measuring method is preferably used for boards having soft and sensitive surfaces, e.g. for insulations. As the distance between laser sensors and board surface is important for the measuring accuracy, the measuring frames supporting the laser heads can be adjusted automatically to the material height. The basic distance is thus kept to a minimum, even though the mat thickness might vary between 10 ... 300 mm. The gaps between the mats are made up for by an automatic swivelling of defined patterns to calibrate the system. The upper and lower laser sensors are synchronised so that the measurement is insensitive against up and down movements as well as vibrations of the mat during conveyance. The signal can be integrated and straightened for porous surfaces.

Function:

• THICK-SCAN L is a continuous, non-contact thickness gauge used in production.
• The laser heads are mounted in pairs opposite to each other to compensate any bending and vibrations.

Location:

• alongside the conveying tracks

Options:

• level-adjusted measuring heads, adjusting cylinders
• operating speed: 635 mm/s
• traversing measuring tracks

Analysis:

• current profiles
• long-term profiles, trends
• UPS for PC

Payback:

• process monitoring and optimisation
• quality assurance

Computer System:

• 19“ industrial computer
• wide-range power pack
• operating system Windows XP
• hard disc in alternate frame
• server hard disc (24 h operation)
• RAID controller for backup
  (mirroring to a second hard disc)
• Ethernet LAN
• monitor TFT 19“
• colour printer